Following up on my earlier post about the crank angle correction — here's what we actually implemented if anyone wants to replicate it.
The math: Force = Torque / (r * sin(theta + phi)), where r is crank radius, theta is crank angle from TDC, and phi accounts for the connecting rod geometry. Near BDC (theta approaching 180), sin approaches zero and the force amplification goes to infinity theoretically. In practice this means your torque-based measurement gets very noisy near BDC because tiny torque fluctuations look like huge force changes.
Our workaround: we only use the torque-based measurement between 30 and 150 degrees of crank rotation. Outside that window, the signal-to-noise ratio is garbage. For most stamping operations, the actual forming work happens in that window anyway.
The $500 setup lisaQ_metrology mentioned is realistic. Here's our BOM:
- Analog output card for the drive (most drives have this built in, just need the connector): $0-150
- 24-bit USB DAQ module (we use a Measurement Computing USB-2408): ~$300
- Shielded cable and connectors: ~$50
- Python script running on a Raspberry Pi for logging and envelope comparison: $0 (plus a $50 Pi)
Total: about $400-550 depending on what you already have.
The limitation vs real strain gauge monitoring: you can't detect off-center loading. The drive sees total torque regardless of where the force is applied on the slide. A dedicated 4-corner tonnage monitor catches a broken pilot pin loading one corner — the drive torque method won't. For die protection (broken punch, double-blank, short feed), the drive method works great. For precision process monitoring, you eventually want strain gauges.
We ran the DIY system for 2 years, proved the value, then got budget approved for a proper Helm system. The DIY data actually helped justify the purchase because we could show management exactly how many bad parts we caught.